FX5U-32MT-ES

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HCM

FX5U-32MT/ES

Delivery time：3 days

Performance Specifications

Control method
I/O control method
Number of input/output points	(1) Number of input/output points
	(2) Remote I/O score
	Total score of (1) and (2)
Programming Specifications	programming language
	Programming Extensions
	Constant Scan
	Constant periodic interrupt
	Timer Performance Specifications
	Number of programs executed
	Number of FB files
Operating Specifications	Execution Type
	Interrupt Type
Instruction processing time	LD X0
	MOV D0 D1
Memory Capacity	Program capacity
	SD Memory Card
	Device/Label Memory
	Data Memory/Standard ROM
Number of flash memory (flash ROM) writes
Maximum number of stored files	Device/Label Memory
	Data memory	P: Number of program files
		FB: Number of FB files
	SD Memory Card	2 GB
		4G,8G,16GB
Clock function	Display information
	precision
Power failure retention (clock data)	Retention method
	Retention time
Power failure retention (device)	Power failure holding capacity
Device Count
User Device Points	Input relay (X)	Octal
	Output relay (Y)	Octal
	Internal relay (M)	Octal
	latching relay (L)	Octal
	Link Relay (B)	Octal
	Anunsheta (F)	Octal
	Link Special Relay (SB)	Octal
	Step Relay (S)	Octal
	Timer system (timer (T))	Octal
	Integrating timer system (Integrating timer (ST))	Octal
	Counter system (counter (C))	Octal
	Counter system (long counter (LC))	Octal
	Data Register (D)	Octal
	Link Register (W)	Octal
	Link Special Register (SW)	Octal
System Device Scores	Special Relays (SM)	Octal
	Special Register (SD)	Octal
Unit Access Devices	Intelligent Function Unit Devices	Octal
Index register score	Index register (Z)	Octal
	Long Index Register (LZ)	Octal
File register score	File Register	Octal
	Extended File Register (ER)	Octal
Nesting points	Nesting (N)	Octal
Pointer points	Pointer (P)	Octal
	Interrupt pointer (I)	Octal
other	Decimal constant (K)	Signed
		Unsigned
	Hexadecimal constant (H)
	Real constant (E)	Single-precision
	string
Power Specifications
Rated voltage
Voltage fluctuation range
Rated frequency
Allowable instantaneous power outage time
Power fuse
Inrush current
Power consumption
DC24V Service Power Supply Capacity
5VDC built-in power supply capacity
Input Specifications
Number of inputs
Input connection shape
Input Format
Input signal voltage
Input signal current	X000～X017
Input impedance	X000～X017
Input ON sensitivity current	X000～X017
Input OFF sensitivity current
Input response frequency	X000～X005
	X006～X017
Input response time (H/W filter delay)	X000～X005
	X006～X017
Input Response Time (Digital Filter Setting)
Pulse waveform
	X000～X005
	X006～X017
Input signal format (input sensor format)
Input circuit isolation
Input operation display
Input circuit configuration
Output Specifications
Number of output points
Output connection shape
Output format
External power supply
Maximum load
Open leakage current
Voltage drop when ON	Y000～Y003
	Y004 or later
Response Time	Y000～Y003
	Y004 or later
Output circuit isolation
Output operation display
Output circuit configuration

Stored program repetition operation

Refresh method
(direct access input/output is possible by specifying direct access input/output (DX, DY))

256 points or less / 384 points or less**
Supported with firmware version 1.100 or higher of the CPU unit. GX Works3 version 1.047Z or higher is required.

384 points or less / 512 points or less**
Supported with firmware version 1.100 or higher of the CPU unit. GX Works3 version 1.047Z or higher is required.

512 points or less

Ladder Diagram (LD), Structured Text (ST), Functional Block Diagram/Ladder Language (FBD/LD)

Function Block (FB), Structured Ladder, Label Programming (Local/Global)

0.2~2000ms (can be set in 0.1ms increments)

1~60000ms (can be set in 1ms increments)

100ms,10ms,1ms

32 bottles

16 bottles (up to 15 for users)

Wait Type, Initial Execution Type, Scan Run Type, Periodic Execution Type, Event Execution Type

Internal timer interrupt, input interrupt, high-speed comparison match interrupt, interrupt from unit**
Intelligent function unit, interrupt from high-speed pulse input/output unit.

34ns*
* for 64k program capacitance steps.

64k steps/128k steps* (128kByte/256kByte, flash memory)
*Supported with CPU unit firmware version 1.100 or higher. GX Works3 version 1.047Z or higher is required.

Memory card capacity (SD/SDHC memory card: up to 16 GB)

120 KB

5 MB

Up to 2,<> times

1 bottles

32 bottles

16 bottles

This is the number of bottles that can be stored in the root folder of 511.

This is the number of bottles that can be stored in the root folder of 65534.

Year, month, day, hour, minute, second, day of the week (leap year automatic detection)

Monthly difference ±45sec/25°C (TYP)

The clock data is held using the power stored in the capacitance capacitor built into the large-capacity
capacitor sequencer. When the voltage of the large capacitor drops, the clock data is not retained correctly. The retention period by the capacitor is 30 days (ambient temperature: 10°C) when fully charged (energized sequencer for more than 25 minutes). The holding period by the capacitor varies depending on the operating ambient temperature. If the ambient temperature is high, the retention period will be shorter.

10 days (ambient temperature: 25°C)

Up to 12K word
devices (high-speed) All devices in the area can be kept in power failure. If you use a battery, you can also hold the devices in the Devices (Standard) area.

The total of X and Y assigned to 1024
input/output is up to 256 points/384 points*.
*Supported with CPU unit firmware version 1.100 or higher. GX Works3 version 1.047Z or higher is required.

32768 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters.

4096 points (fixed)

1024 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters.

8000 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters.

32768 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters.

10000 points (fixed)

12000 points (fixed)

65536 points (U□\G□)

The 24-point
index register (Z) and long index register (LZ) can be set for a total of 24 words or less.

The 12-point
index register (Z) and long index register (LZ) can be set for a total of 24 words or less.

32768 points (can be changed by parameters)
Within the capacity range of CPU built-in memory, it can be changed by parameters.

32768 points (stored in SD memory card)

15 points (fixed)

4096 points

178 points (fixed)

16-bit: -32768~+32767
32-bit: -2147483648~+2147483647

16-bit time: 0~65535
32-bit time: 0~4294967295

16-bit: 0~FFFF
32-bit: 0~FFFFFFFF

E-3.40282347+38～E-1.17549435-38，0，E1.17549435-38～E3.40282347+38

Shift JIS code Maximum half-width 255 characters (256 characters including NULL)

AC100～240V

-15%，+10%

50/60Hz

Operation continues for instantaneous power outages of 10 ms or less.
When the power supply voltage is AC200V, it can be changed to 10~100ms by user program.

250V 3.15A Time Lag Fuse

Max. 25A 5ms or less / AC100V Max. 50A 5ms or less / AC200V

This value is the value when the DC30V service power supply is consumed at the maximum when the maximum configuration can be connected to a 24W
CPU unit. (including input circuit current)

[When DC24V service power supply is used in the input circuit of the CPU unit]
Ambient temperature 0~55°C: 400mA Ambient temperature less than 0°C: 300mA [When external power supply is used for CPU unit input circuit]
Ambient temperature 0~55°C: 480mA Ambient temperature less than 0°C: 380mA

DC24V service power supply is consumed when I/O units are connected, and the available current is reduced. For details on DC24V service power supply, refer to MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware).

900mA

16 points

Detachable terminal block (M3 screw)

Sink/Source

DC24V +20%，-15%

5.3mA/DC24V

4.3kΩ

3.5mA or more

1.5mA or less

For details on capturing pulses with a response frequency of
200kHz 50k~200kHz, refer to the MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware Edition).

10kHz

ON: 2.5μs or less OFF: 2.5μs or
less

ON: 30μs or less OFF: 50μs or less

None,10μs,50μs,0.1ms,0.2ms,0.4ms,0.6ms,1ms,5ms,10ms,20ms,70.<>ms,<>ms,<>ms,<>ms,<>ms,<>ms
When using the product in an environment with a lot of noise, set the digital filter.

T1 (pulse width): 2.5μs or more T2 (rise/fall time): 1.25μs or
less

T1 (pulse width): 50μs or more T2 (rise/fall time): 25μs or
less

Non-voltage contact input
sink: NPN open collector transistor
source: PNP open collector transistor

Optocoupler isolation

LED lights up when input is ON

16 points

Detachable terminal block (M3 screw)

Transistor/sink output

DC5～30V

The total load current per 0.5A
/1 point common should be as follows.
4-point common: 0.8A or less

0.1mA or less/30VDC

1.0V or less

1.5V or less

2.5μs or less/10mA or more (DC5~24V)

0.2ms or less/200mA or more (24VDC)

Optocoupler isolation

LED lights up when output is ON

Functional Specifications

Firmware update function
Scan monitoring function (watchdog timer setting)
Clock function
Write in RUN	Circuit block change during RUN
Interrupt function	Multiple interrupt function
PID control function
Constant Scan
Remote operation	Remote RUN/STOP
	Remote PAUSE
	Remote RESET
Device/Label Memory Area Settings
Program capacity setting
Internal buffer capacity setting
Device initial value setting
Latching function
Memory card function	SD memory card forced stop
	Boot operation
Device/Label Access Service Processing Settings
Data logging capabilities
Memory dump function
Real-time monitoring function
RAS function	Self-diagnostic function
	Error clearing
	Event history function
Backup/restore capability
Security Features
IP filter function
High-speed input/output capability	High-speed counter function
	Pulse width measurement function
	Input interrupt function
	Positioning function
	PWM output function
Built-in analog functions	Analog input function
	Analog output function
Built-in Ethernet capability
CC-Link IE Field Network Basic Function
Serial communication function
MODBUS communication function

This function uses an SD memory card to update the firmware version of the unit.

By monitoring the scan time, abnormalities in the hardware and programs of the CPU unit are detected.

It is used for time management in system functions such as event history function and date in data logging function.

The edited part on the ladder edit screen on the engineering tool is written to the CPU unit in circuit units. Edits that span multiple locations can be written to the CPU unit at the same time.

When an interrupt of another factor occurs when the interrupt program is executed, the execution of the program with a lower priority is suspended according to the set priority, and the program with a higher priority for which the execution conditions are met is executed.

PID control is performed by PID control instructions.

Run the program repeatedly while keeping the scan time constant.

Externally put the CPU unit in the RUN/STOP/PAUSE state while leaving the RUN/STOP/RESET switch of the CPU unit in the RUN position.

When the CPU unit is in the STOP state, the CPU unit is reset by external operation.

Set the capacity of each area of the device/label memory.

Set to change the program capacity.

Sets the amount of area (internal buffer) that the system uses to temporarily store data logging results and memory dump collection results.

Set the initial value of the device to be used in the program to the device without programming.

Even when the power is turned off → ON, the contents of the device/label of the CPU unit are kept in power failure.

Even if the function using the SD memory card is running, you can disable the SD memory card without turning the power off.

Files stored on the SD memory card are transferred to the destination memory automatically determined by the CPU unit when the CPU unit is turned off→ ON or reset.

Set the number of device/label access service operations performed by the END process as a parameter.

Collects data at a specified interval or at any timing, and saves the collected data as a file on an SD memory card.

Saves the device value of the CPU unit at any time.

At the specified interval or at any timing, the contents of the specified device of the CPU unit are monitored in real time.

The CPU unit itself diagnoses the presence or absence of abnormalities.

Clears all ongoing continuation errors in bulk.

The CPU unit collects and stores errors that occur to the CPU unit, expansion board, expansion adapter, and intelligent function unit. You can check the saved history in chronological order.

This function backs up the program files, parameter files, device/label data, etc. of the CPU unit to the SD memory card. The backed up data can be restored as needed.

Prevents theft, falsification, erroneous operation, unauthorized execution, etc. due to unauthorized access from a third party to customer assets stored on PCs and customer assets in units in the FX5 system.

Identifies the IP address of an external device via Ethernet and blocks access from unauthorized IP addresses.

Using the inputs of the CPU unit and the high-speed pulse input/output unit, high-speed counters, pulse width measurements, input interrupts, and more can be performed.

Positioning operation can be performed using the transistor output of the CPU unit and the high-speed pulse input/output unit.

PWM output can be performed using the transistor output of the CPU unit and the high-speed pulse input/output unit.

Voltage input is possible with two analog inputs built into the FX2U CPU unit.

One analog output is built into the FX1U CPU unit, and voltage output can be performed.

Ethernet-related functions such as connection to MELSOFT products and GOT, socket communication, file transfer by FTP, web server (HTTP), SNTP client, and simple CPU communication function.

This function uses general-purpose Ethernet to communicate between a master station and a remote station.

These are serial communication-related functions such as simple PC-to-PC links, parallel links, MC protocols, inverter communication functions, and procedural communication.

Connection with MODBUS RTU/TCP compatible products is possible. Master and slave functions are available.

General Specifications

Operating ambient temperature
Storage ambient temperature
Ambient humidity
Storage ambient humidity
Vibration resistance	DIN rail mounting	Frequency: 5~8.4Hz
		Frequency:8.4~150Hz
	Direct installation	Frequency: 5~8.4Hz
		Frequency:8.4~150Hz
Shockproof
Noise immunity
Withstand voltage	Between the power supply terminal (AC power supply) and the ground terminal
	DC24V service power supply and between input terminal (DC24V) and ground terminal
	Between output terminal (transistor) and ground terminal
Insulation resistance	Between the power supply terminal (AC power supply) and the ground terminal
	DC24V service power supply and between input terminal (DC24V) and ground terminal
	Between output terminal (transistor) and ground terminal
ground
Usage atmosphere
Altitude used
Installation location
Overvoltage Category
Pollution degree

-20~55°C, no freezing and input
and output derating. For details, refer to the MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware).
Products manufactured before June 2016 will be 6~0°C. For details on the Intelligent Function Unit, refer to the manual of each product.
There is a difference in specifications when used below 55°C. For details, refer to the MELSEC iQ-F FX0S/FX5UJ/FX5U/FX5UC User's Manual (Hardware).

-25~75°C, no freezing

When using in a low temperature environment with 5~95%RH, no condensation, use in an environment
where there is no sudden temperature change. If there is a sudden change in temperature due to opening or closing of the control panel, condensation may occur, which may cause fire, malfunction, or malfunction. Also, dehumidify with air conditioning to prevent condensation.

5~95%RH, non-condensing

Fragment amplitude: 1.75mm 10 times in each direction of X, Y, and Z (80 minutes in total)
If the system includes equipment that meets the above vibration specifications according to IEC61131-2, the vibration resistance specifications of the entire system will be reduced to
the specifications of that device.

Acceleration: 4.9 m/s 2 10 times in each direction of X, Y, and Z (80 minutes in total)
If the system includes equipment that meets or meets the above vibration specifications according to IEC61131-2, the vibration resistance specifications of the entire system will be reduced to
the specifications of that device.

Fragment amplitude: 3.5mm 10 times in each direction of X, Y, and Z (80 minutes in total)
If the system includes equipment that meets the above vibration specifications according to IEC61131-2, the vibration resistance specifications of the entire system will be reduced to
the specifications of that device.

Acceleration: 9.8m/s 2 If the system includes a device that meets or meets the above vibration specifications according to IEC61131-2
, the vibration resistance specification of the entire system will be reduced to
the specifications of that device.

147 m/s 2, action time 11 ms, 3 times X, Y, and Z in half-wave sinusoidal pulses The criteria
are IEC61131-2.

Noise voltage 1000Vp-p, noise width 1μs, period 30~100Hz

AC1.5kV for 1 minute

AC500V for 1 minute

DC500V insulation resistance meter 10MΩ or more

For Class D grounding (grounding resistance: 100 Ω or less) < common grounding with strong electrical systems is not possible>
refer to the MELSEC iQ-F FX5S/FX5UJ/FX5U/FX5UC User's Manual (Hardware Edition).

No corrosive or flammable gases, no conductive dust

It cannot be used in an environment pressurized above 0~2000m
atmospheric pressure.
It may fail.

The sequencer itself in the control panel itself is intended to be installed in
an indoor environment.

II. Indicates which distribution part the device is expected to be connected to, from the public distribution network to the machinery and equipment on the premises.
Category II applies to equipment supplied from fixed installations. The withstand surge voltage of equipment up to 300V rated is 2500V.

2The following
is an index indicating the degree of generation of conductive substances in the environment in which the equipment is used. Pollution level 2 only produces non-conductive pollution. However, it is an environment in which temporary conductivity can occur due to accidental condensation.